WaferScan Non-Contact Profilometer Rudolph Tamar Technology for Parts 7137

Includes:

• Tamar Waferscan w/ Granite Isolation Slab on Cart with Casters
• Keyboard and Monitor
• Joystick
• Software (See pictures for more detail)
  • ​Software User Manual

        Objectives

• Manufacturer: Olympus
• LmPlanFLN
• 5x/0.13 | ∞/-/FN26.5
• 10x/0.25 | ∞/-/FN26.5
• 20x/0.40 | ∞/0/FN26.5
• 50x/0.50 | ∞/0/FN26.5
• 100x/.80 | ∞/0/FN26.5
• Seiwa Optical M Plan Apo 10 SB ∞ / 0 Infinity Microscope Objective Lens SLWD39 (Objective under Stage)

        Wafer Chucks

• Blank Chuck
• 1" Chuck
• SBF-11791-009 2"
• SBF-11792-009 3"
• SBF-11976-009 5"
• SBF-11790-009 100mm
• Chuck Holder Rack

Tamar Quality Wafers

Parker ZETA57-51 Stage Motors with Vexta Clean damper 06CL-6.3F (X 3)

Tamar Gold Standard Daily Qual FPA

Qty: 2

Angled Gage Blocks

"1 & 3 Degree and 20 Min"

• Ref. Gage Block Set of 10; Sizes: 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, 1.0, 1.3, 1.5, 1.7 & 2.0 MMP/N 321-02003

Software

• Viewsonic, EVGA Driver Installation CD, Heidenhain IK 5000 Quadra-Check, CyberLink Power DVD 10, Nero 9 Essentials, SuperMicro Device Drivers
• Tamar Technologies WaferScan Upgrade
  • Version 2.651
  • Date: 5/1/08

Shipping

• Weight: ~1000 lbs
• Actual Weight: 
• Dimensions(LxWxH): 41 x 35 x 72"
• Actual Dimensions: 

Tamar Technology was purchased by Rudolph.  The following is taken from Metrology World 11/04/11:

Tamar Technology Ships Its First Fully Automated WaferScan System

Newbury Park, CA - Tamar Technology, a precision metrology company specializing in metrology solutions for the semiconductor, hard disk drive and medical device industries, shipped its first fully automated WaferScan system to a major semiconductor fab. The system addresses metrology requirements for Through Silicon Via (TSV) etch depth, deep trench depth, wafer thickness, photo-resist thickness, and hole diameter.

The system includes Tamar's proprietary Wafer Thickness Sensor (WTS) to measure the depth of TSVs and deep narrow trenches. The system also includes Tamar's proprietary Visible Thickness Sensor (VTS) to measure thickness of photo resist, thick films and various polymers. Integrated with Tamar's sensor is a video microscope for automated alignment and vision measurements, such as hole diameter.

"Tamar's WTS can measure etch depth and wafer thickness of single or bonded wafers. The measurement is optical and non-destructive and it is the only technology that can measure any TSV or trench regardless of the diameter or depth," says David Grant, president of Tamar Technology. "One of the challenges that Tamar's sensors were able to overcome was the large range of etch measurements required, which can be hundreds of microns deep and as thin as one micron wide."

Tamar's VTS measures the thickness of films and polymers on the surface and at the bottom of etched features to ensure the presence of material and to monitor the thickness variation across the wafer.

This system is flexible and can be configured with multiple sensors to accommodate different measurement requirements. "The combination of a microscope with the different sensors allows machine vision alignment producing the accurate positioning required for these precision applications," says Grant. "It runs fully automated using programmed recipes and communicates with the factory host via SECS/GEM." Grant adds, "Installation of this tool indicates how well our technology has been accepted and validates our efforts in advancing to fully automated, clean room class 1 semiconductor tools."

The Tamar system is used in production to monitor various processes and helps to reduce costs. Because of its non-destructive nature, product yields are improved as process excursions are monitored in near real time.

SOURCE: Tamar Technology

Please Ask For Shipping Quote

Sold as is with 30 day Right of Return, only pictured items included
Easy return/refund for any reason
Anacapa Equipment

RETURNS 
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Measurement equipment

Wafer Scan 

Metrology

Semiconductor